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> Á¦Ç°¼Ò°³ > Bonding
System |
Manufacturing Process
ACF
Bonder->Pre Bonder->Main Bonder
Specification
- Panel
Size: 1"~5", 2"~8", 7"~15"
- Tact Time :
3.8sec/chip -> °í°´ »ç¾ç¿¡ µû¶ó
º¯°æ °¡´É
- ACF Bonding : Short Bar
Type
- Chip Supply : Tray
Type ( COG & COF °â¿ë °¡´É
)
- Pre Bonding : Index Type ( 1Unit : 4Head )
or Gantry
Type ( 1Unit : 2Head )
- Main Bonding : Long
Bar Type or
Short Bar Type
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Manufacturing Process
Pad
cleaner -> ACF Attach -> Pre Bonder -> Main Bonder -> Lead
Checker
Specification
- Panel Size : 12.1"~24", 15"~32", 26"~47",
37"~57"
- Tact Time : 13sec ( 18.5¡°±âÁØ, Main Bonding :
6sec ) -> °í°´ »ç¾ç¿¡ µû¶ó º¯°æ °¡´É
- Pad Cleaner : Wiper
Type
- ACF Bonding : Auto Partial Bonding Type or Long
Bar Type
- Pre Bonding : Index Type ( 1Unit : 4Head )
or Gantry Type ( 1Unit : 2Head )
- Main Bonding :
Long Bar Type or Short Bar Type
- Lead Checker : Total
inspection or Sampling Inspection |
Manufacturing Process
- PCB
Loader -> PCB Bonder -> Dispenser -> Inspection ->
Unloader Specification
-
Panel Size : 12.1"~24", 15"~32", 26"~47", 37"~57",67"
- Tact Time : 9.5sec ( 12.1" ±âÁØ, Main Bonding : 5sec )
- ACF Bonding : Auto Partial Bonding Type or Long Bar
Type
- Main Bonding : Long Bar Type or Short Bar
Type
- Inspection : Index Type or Shuttle
Type | |
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