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Home > Á¦Ç°¼Ò°³ > Bonding System

Manufacturing Process

   ACF Bonder->Pre Bonder->Main Bonder


Specification

    - Panel Size: 1"~5", 2"~8", 7"~15"

    - Tact Time : 3.8sec/chip -> °í°´ »ç¾ç¿¡ µû¶ó 
       º¯°æ °¡´É

    - ACF Bonding :  Short Bar Type

    - Chip Supply : Tray Type 
      ( COG & COF °â¿ë °¡´É )

    - Pre Bonding : Index Type ( 1Unit : 4Head ) or
                             Gantry Type ( 1Unit : 2Head )

    - Main Bonding : Long Bar Type or
                               Short Bar Type

Manufacturing Process


   Pad cleaner -> ACF Attach -> Pre Bonder -> Main Bonder -> Lead Checker


Specification

   - Panel Size : 12.1"~24", 15"~32", 26"~47", 37"~57"

   - Tact Time : 13sec ( 18.5¡°±âÁØ, Main Bonding : 6sec ) -> °í°´ »ç¾ç¿¡ µû¶ó º¯°æ °¡´É

   - Pad Cleaner : Wiper Type

   - ACF Bonding : Auto Partial Bonding Type or Long Bar Type

   - Pre Bonding : Index Type ( 1Unit : 4Head ) or Gantry Type ( 1Unit : 2Head )

   - Main Bonding : Long Bar Type or Short Bar Type

   - Lead Checker : Total inspection or Sampling Inspection

Manufacturing Process

   - PCB Loader -> PCB Bonder -> Dispenser -> Inspection -> Unloader
 
Specification

   - Panel Size : 12.1"~24", 15"~32", 26"~47", 37"~57",67"

   - Tact Time : 9.5sec ( 12.1" ±âÁØ, Main Bonding : 5sec )

   - ACF Bonding : Auto Partial Bonding Type or Long Bar Type

   - Main Bonding : Long Bar Type or Short Bar Type

   - Inspection : Index Type or Shuttle Type